Rotatable copper targets are specialized oxygen free copper with extremely high purity used in a sputtering deposition technique called magnetron sputtering. Sputtering is a physical vapor deposition (PVD) process, a high-speed process where superfast ions hit a sputtering target and dislodge minuscule particles, widely used in the semiconductor, electronics, and thin film industries to deposit thin films of various materials onto substrates.
Production Process
The standard manufacturing process of rotatory copper target starts from vacuum melting, casting of electrolytic copper ingots, and hot extrusion and processing of ingots. Firstly, the high-purity copper ingot is produced through vacuum melting, and then it is hot extruded to copper tube blank. After that it is than straightened by hydraulic calibration machine to achieve less than 1mm/m straightness. After that, the straightened tube blank is precision processed on the CNC machine to its dimensional accuracy meanwhile the surface roughness shall meet the specified requirements. Fabmann can supply premium copper target materials in different parity such as 4N (99.99%), 4N5 (99.995%) and 5N (99.999%) for OEM PVD (Physical vapor deposition) systems, and we focus a lot on advanced thermomechanical processing (ATMP) to ensure better quality of crystallographic texture and grain size for ultra-high performance with minimum cost. We can supply both rotatory and planar copper sputter target materials with grain size smaller than 80μm and oxygen content less than 5ppm. Below is detailed production process:
√ The high-purity electrolytic copper is placed in a vacuum induction melting furnace, and then vacuum melting is carried out.
√ The obtained molten copper is flowed into the crystallizer of the casting furnace for copper round ingot.
√ The copper ingot is then transferred to the extrusion barrel for hot extrusion, and it requires minimum 25KN pressure with 400-500° temperature. It is vital that the pressure is big enough to achieve grain size smaller than 150μm during hot extrusion process.
√ The copper tube blank is naturally cooled to room temperature, and then straightened afterwards. If the copper tube wall is greater than 20mm, it is necessary to heat the tube between 200~300° before straightening.
√ The copper tube blank is cut and machined to desired specification, and it is necessary to spray coolant to prevent copper tube target from deforming due to machining stress.
√ After grinding and polishing, the finished rotatory copper target material is obtained.
√ Quality control, this is one of the most important processes to for confirm whether the product is up to specification. It includes visual inspection, dimensional check, and surface roughness measurements. It also involves a set of tests such metallographic structure check, Oxygen/Hydrogen analysis, X-ray fluorescence (XRF), glow discharge mass spectrometry (GDMS), to verify the purity and composition of the target.
Comparing with planar targets, rotary target contains more material and offers a greater utilization, which means longer production runs and reduced downtime of the system, increases the throughput of the coating equipment. Besides, rotary sputter target allows the use of higher power densities due to the heat build-up being spread evenly over the surface area of the target. As a consequence, an increased deposition speed could be achieved along with improved performance during reactive sputtering.
Advantages
√ Improved uniformity, the rotation of the target helps achieve more uniform erosion and deposition across its surface. As the target rotates, different areas of the target are exposed to the ion bombardment, leading to more even erosion and deposition rates.
√ Improved target utilization, the erosion is spread out over a larger surface area, reducing localized damage and extending the target's lifespan. This also helps improve process efficiency and reduces downtime for target replacement.
√ Enhanced deposition rate, the rotational movement of the target can improve the ionization and sputtering efficiency, which lead to higher deposition rates while reducing the overall process time required to achieve the desired film thickness.
√ Improved film quality, the improved target utilization and uniformity can helps minimize defects, impurities, and stress within the deposited films, resulting in improved electrical, optical, and mechanical properties.
Dimension and Capability
Fabmann is dedicated to provide custom fabrication service, and below is our supply scope:
√ OD from 2inch to7inch
√ ID from 1.5inch to 6inch
√ Length from 50inch to 130inch (1,270mm to 3,302mm)
√ Bonding service available
√ 4N (99.99%), 4N5 (99.995%) & 5N (99.999%)
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